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Cost Effective Liquid Cooling Plate For AI Data Centers And High Performance Servers
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sales4@trumony.com
+86 18018119117
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Cost Effective Liquid Cooling Plate For AI Data Centers And High Performance Servers

MOQ: 1
가격: 협상 가능
표준 포장: 나무 팔레트
배송 기간: 30일
결제수단: 티/티
공급능력: 100 PC / 일
상세 정보
제품 설명
상세 정보
원래 장소
중국
브랜드 이름
Trumony
인증
ISO9001,IATF16949
모델 번호
트루모니-RR-051904
표면 처리:
열 인터페이스 재료
코어 합금:
3003+1.5%Zn
유형:
브레이징
재료:
알류미늄
등급:
3003
프로세스:
스탬핑
강조하다:

liquid cooling plate for AI data centers

,

high performance server liquid cold plate

,

cost effective liquid cooling plate

제품 설명
Product Details
Place of Origin
China
Brand Name
Trumony
Certification
ISO9001, IATF16949
Model Number
RR-051904
Core Process
Continues Brazing, Stamping
Shape
Customized
Warranty
10 Year
Surface Treatment
Epoxy Coating

Product Overview
Introduction:
Our Cost-Effective Liquid Cooling Plate is a precisely engineered thermal management solution developed for the intensive cooling demands of AI data centers and high-performance computing servers. It is designed to provide a high-performance, value-driven approach to directly dissipate the substantial heat generated by modern computing components, particularly GPUs.
Manufactured from high-grade aluminum alloys, this cooling plate is constructed to deliver an optimal balance of performance and affordability. The design features a geometry and internal flow path that can be tailored to the specific thermal loads and spatial constraints of server configurations. Utilizing reliable manufacturing processes, it forms a durable, leak-resistant assembly. When combined with high-performance thermal interface materials (TIMs), it enables efficient heat transfer from critical components, ensuring stable operation.
Key Parameters
Item
Specification
Material / Value
1
Base Material
6061 Aluminum
2
Coolant
Deionized Water / Single-Phase Coolant
3
Core Process
High-Efficiency Manufacturing (e.g., Stamping/Brazing)
4
Target Application
GPU / High-Power ASIC Cooling

Cost Effective Liquid Cooling Plate For AI Data Centers And High Performance Servers 0

Primary Applications
This liquid cooling plate is a key thermal solution engineered for the economic scaling of advanced computing infrastructure. Its primary application is:
  • GPU and Accelerator Cooling in AI/HPC Clusters:​ Provides direct, efficient heat extraction from high-power GPUs, AI accelerators, and other specialized processors within data center racks, enabling sustained performance for AI training and high-performance computing workloads.
Key Advantages:
  • Optimized Performance-to-Cost Ratio:​ The design and manufacturing processes are optimized to deliver high thermal performance and reliability at a competitive price point, enabling the cost-effective deployment of liquid cooling across large-scale AI data center fleets.
  • Thermal Design for High Heat Flux:​ The internal channel layout and base plate design are engineered to manage the extreme heat flux densities of modern GPUs and AI chips. When paired with suitable thermal interface materials, it minimizes thermal resistance at the critical junction.
  • Customizable for Rack Integration:​ The plate’s form factor, mounting scheme, and coolant port locations can be customized to fit within standard server chassis and rack layouts, facilitating easier integration and maintenance in data center environments.
  • Reliable for 24/7 Operation:​ Built with data center uptime in mind, the cooling plate undergoes stringent quality checks for leaks and structural integrity, ensuring dependable performance under continuous, heavy computational loads.
  • Scalable Production for Data Center Rollouts:​ The product and its manufacturing are designed for scalability, supporting rapid production ramp-up to meet the volume requirements of large-scale data center deployments and new server builds.
Our cost-effective liquid cooling plates are a practical and efficient solution for data centers upgrading to liquid cooling for AI servers, where managing both thermal performance and total cost of ownership is critical. We provide support from initial thermal analysis and design adaptation to volume manufacturing.
Frequently Asked Questions
Q: How do you achieve a cost-effective design for AI server cooling plates?
A:​ We optimize the design for manufacturability, utilizing high-volume production processes and value engineering on materials and features without compromising the core thermal performance required for GPU cooling. This allows us to offer a reliable product at a competitive price point for scale deployment.
Q: What is the design process for a cooling plate compatible with a specific GPU module?
A:​ We start by analyzing the thermal design power (TDP), footprint, and mounting of your target GPU. Our engineers then propose a cold plate design that ensures full coverage of the heat-generating dies, optimizes flow for the expected heat load, and interfaces correctly with your server's cooling loop and mechanical frame.
Q: Do you recommend specific thermal interface materials (TIMs) to use with your plates?
A:​ While we specialize in the cold plate itself, we have extensive experience and can provide guidance on TIM selection (e.g., thermal pads, grease, phase-change materials) based on the interface pressure, thermal performance needs, and reliability requirements of your application to ensure optimal system-level performance.
Q: What are your payment terms for a data center-scale order?
A:​ For large production orders typical in data center projects, we can offer structured payment terms. Commonly, this involves a 30% deposit, 40% upon pre-shipment inspection, and the 30% balance due after shipment. We can tailor terms based on the project's specific schedule and volume.
Q: Can you provide a thermal performance estimate or reference design for common GPU platforms?
A:​ Yes. Based on our existing designs and thermal simulations, we can provide performance estimates for cooling plates designed for popular GPU platforms. We can also adapt these reference designs to meet your specific integration requirements.
Q: What is the lead time for production once a design is finalized?
A:​ For production utilizing established manufacturing flows, the lead time is typically 5-6 weeks after design approval and order confirmation. This timeline allows for material procurement, production scheduling, and thorough quality testing.
태그: 

알루미늄 자동차 라디에이터,  

알루미늄 자동차 부품,  

liquid cooling plate for AI data centers

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지금 연락하세요
상품
제품 세부 정보
상품

알루미늄 호일 롤

액체 냉판

배터리 트레이

알루미늄 마이크로채널 튜브

열 인터페이스 재료

맞춘 알류미늄 압출

알루미늄 합금 시트

알루미늄 에어 배터리
이름
  • 이름
  • 이름
  • 이름
Cost Effective Liquid Cooling Plate For AI Data Centers And High Performance Servers
MOQ: 1
가격: 협상 가능
표준 포장: 나무 팔레트
배송 기간: 30일
결제수단: 티/티
공급능력: 100 PC / 일
상세 정보
제품 설명
상세 정보
원래 장소
중국
브랜드 이름
Trumony
인증
ISO9001,IATF16949
모델 번호
트루모니-RR-051904
표면 처리:
열 인터페이스 재료
코어 합금:
3003+1.5%Zn
유형:
브레이징
재료:
알류미늄
등급:
3003
프로세스:
스탬핑
최소 주문 수량:
1
가격:
협상 가능
포장 세부 사항:
나무 팔레트
배달 시간:
30일
지불 조건:
티/티
공급 능력:
100 PC / 일
강조하다

liquid cooling plate for AI data centers

,

high performance server liquid cold plate

,

cost effective liquid cooling plate

제품 설명
Product Details
Place of Origin
China
Brand Name
Trumony
Certification
ISO9001, IATF16949
Model Number
RR-051904
Core Process
Continues Brazing, Stamping
Shape
Customized
Warranty
10 Year
Surface Treatment
Epoxy Coating

Product Overview
Introduction:
Our Cost-Effective Liquid Cooling Plate is a precisely engineered thermal management solution developed for the intensive cooling demands of AI data centers and high-performance computing servers. It is designed to provide a high-performance, value-driven approach to directly dissipate the substantial heat generated by modern computing components, particularly GPUs.
Manufactured from high-grade aluminum alloys, this cooling plate is constructed to deliver an optimal balance of performance and affordability. The design features a geometry and internal flow path that can be tailored to the specific thermal loads and spatial constraints of server configurations. Utilizing reliable manufacturing processes, it forms a durable, leak-resistant assembly. When combined with high-performance thermal interface materials (TIMs), it enables efficient heat transfer from critical components, ensuring stable operation.
Key Parameters
Item
Specification
Material / Value
1
Base Material
6061 Aluminum
2
Coolant
Deionized Water / Single-Phase Coolant
3
Core Process
High-Efficiency Manufacturing (e.g., Stamping/Brazing)
4
Target Application
GPU / High-Power ASIC Cooling

Cost Effective Liquid Cooling Plate For AI Data Centers And High Performance Servers 0

Primary Applications
This liquid cooling plate is a key thermal solution engineered for the economic scaling of advanced computing infrastructure. Its primary application is:
  • GPU and Accelerator Cooling in AI/HPC Clusters:​ Provides direct, efficient heat extraction from high-power GPUs, AI accelerators, and other specialized processors within data center racks, enabling sustained performance for AI training and high-performance computing workloads.
Key Advantages:
  • Optimized Performance-to-Cost Ratio:​ The design and manufacturing processes are optimized to deliver high thermal performance and reliability at a competitive price point, enabling the cost-effective deployment of liquid cooling across large-scale AI data center fleets.
  • Thermal Design for High Heat Flux:​ The internal channel layout and base plate design are engineered to manage the extreme heat flux densities of modern GPUs and AI chips. When paired with suitable thermal interface materials, it minimizes thermal resistance at the critical junction.
  • Customizable for Rack Integration:​ The plate’s form factor, mounting scheme, and coolant port locations can be customized to fit within standard server chassis and rack layouts, facilitating easier integration and maintenance in data center environments.
  • Reliable for 24/7 Operation:​ Built with data center uptime in mind, the cooling plate undergoes stringent quality checks for leaks and structural integrity, ensuring dependable performance under continuous, heavy computational loads.
  • Scalable Production for Data Center Rollouts:​ The product and its manufacturing are designed for scalability, supporting rapid production ramp-up to meet the volume requirements of large-scale data center deployments and new server builds.
Our cost-effective liquid cooling plates are a practical and efficient solution for data centers upgrading to liquid cooling for AI servers, where managing both thermal performance and total cost of ownership is critical. We provide support from initial thermal analysis and design adaptation to volume manufacturing.
Frequently Asked Questions
Q: How do you achieve a cost-effective design for AI server cooling plates?
A:​ We optimize the design for manufacturability, utilizing high-volume production processes and value engineering on materials and features without compromising the core thermal performance required for GPU cooling. This allows us to offer a reliable product at a competitive price point for scale deployment.
Q: What is the design process for a cooling plate compatible with a specific GPU module?
A:​ We start by analyzing the thermal design power (TDP), footprint, and mounting of your target GPU. Our engineers then propose a cold plate design that ensures full coverage of the heat-generating dies, optimizes flow for the expected heat load, and interfaces correctly with your server's cooling loop and mechanical frame.
Q: Do you recommend specific thermal interface materials (TIMs) to use with your plates?
A:​ While we specialize in the cold plate itself, we have extensive experience and can provide guidance on TIM selection (e.g., thermal pads, grease, phase-change materials) based on the interface pressure, thermal performance needs, and reliability requirements of your application to ensure optimal system-level performance.
Q: What are your payment terms for a data center-scale order?
A:​ For large production orders typical in data center projects, we can offer structured payment terms. Commonly, this involves a 30% deposit, 40% upon pre-shipment inspection, and the 30% balance due after shipment. We can tailor terms based on the project's specific schedule and volume.
Q: Can you provide a thermal performance estimate or reference design for common GPU platforms?
A:​ Yes. Based on our existing designs and thermal simulations, we can provide performance estimates for cooling plates designed for popular GPU platforms. We can also adapt these reference designs to meet your specific integration requirements.
Q: What is the lead time for production once a design is finalized?
A:​ For production utilizing established manufacturing flows, the lead time is typically 5-6 weeks after design approval and order confirmation. This timeline allows for material procurement, production scheduling, and thorough quality testing.
태그: 

알루미늄 자동차 라디에이터,

알루미늄 자동차 부품,

liquid cooling plate for AI data centers

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집 상품 회사 소개 비디오 뉴스 사건 문의하기
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86-512-62532616

이메일

sales4@trumony.com
+86 18018119117
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